The microstimulator is fabricated in three main steps. The first step involves preparing the electrodes. A glass bead is melted to the Ta stem; a glass washer is melted to the Ir stem and then to the glass capillary tube. This is necessary to protect the IC chip from heat during the glass-to-metal sealing process, whereas, the lesser heat (approximately 80° C at 2 mm from where the heat is being applied) conducted during the glass-to-glass sealing is safe for the chip. The second step involves assembling the various internal components and attaching them to the Ta-glass bead end. The final step involves inserting the electronic subassembly into the Ir-glass capillary section and making a final hermetic seal at the Ta-glass bead to glass capillary junction [1].